SE95_7
?NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 07 2 September 2009
24 of 27
NXP Semiconductors
SE95
Ultra high accuracy digital temperature sensor and thermal watchdog
For further information on temperature proles, refer to Application Note AN10365
Surface mount reow soldering description .
17. Abbreviations
MSL: Moisture Sensitivity Level
Fig 21. Temperature proles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Table 21. Abbreviations
Acronym
Description
ADC
Analog-to-Digital Converter
ESD
ElectroStatic Discharge
HBM
Human Body Model
I
2
C-bus
Inter-Integrated Circuit bus
I/O
Input/Output
LSB
Least Signicant Bit
LSByte
Least Signicant Byte
MM
Machine Model
MSB
Most Signicant Bit
MSByte
Most Signicant Byte
OTP
One-Time Programmable
POR
Power-On Reset
SMBus
System Management Bus
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